Indium Corporation's Tim Jensen, senior product manager for engineered solders, will share his expertise during two Surface Mount Technology Association (SMTA) Webtorials on March 18 and 25 from 1-2:30 p.m. EST.

Jensen's presentation, Process Optimization and Defect Elimination for PCB Assembly, includes a detailed discussion of soldering materials, components, and PCBs that will provide the important aspects needed to produce a complete electronics product that meet current and future legislative restrictions.

Jensen is an SMTA-certified process engineer. He has more than 15 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation's technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a product manager, Jensen is responsible for Indium Corporation's most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials. He earned his bachelor's degree in chemical engineering from Clarkson University and his master's in business administration from Syracuse University.

SMTA Webinars and Webtorials provide opportunities to learn about the latest information on electronics assembly and advanced packaging without leaving the office. For more information or to register, visit

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

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