Liao's presentation, The Application of Epoxy Flux, explained the benefits of using an epoxy flux for reinforcing CSP, BGA, flip-chip, and PoP assemblies to improve mobile phone performance against drop shock, thermal cycling, and dendrite risk. Epoxy flux also eliminates the drawbacks of underfill by integrating standard SMT solder pastes, fluxes, and underfill materials into a solitary reflow process to provide enhanced solder joints.
Liao is the area technical manager for northern China. He provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction. Liao has a bachelor's degree from Tianjin University in mechanical and electronics engineering.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.