Dr. Lee’s first presentation, Partially-Dried No-Clean Flux At Under-Component Terminations: Risks and Solutions, will discuss a new halogen-free no-clean SnAgCu solder paste that has been developed to address the reliability issues caused by insufficiently dried or burnt-off flux residue that can affect reliability.
Achieving High Reliability Via Pressureless Sintering of Nano-Ag Paste for Die-Attach reveals the results of developing a nano-Ag sintering paste designed for a pressureless sintering process under air. The paste was tested in different sintering temperatures and evaluated for porosity and effects of thermal aging.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
ICEPT 2015 is a four-day event featuring the latest technological developments in electronics packaging, manufacturing and packaging equipment, and emerging research and development trends. For information, visit www.icept.org.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.