Briggs’ presentation, Transition From Water-Soluble to No-Clean Solder Paste – Just How Easy Is It?, compares the printing and reflow characteristics of water-soluble and no-clean solder pastes to demonstrate the ease of converting to a no-clean soldering process. Briggs will also share a simple strategy to enable the small process changes necessary to make the switch from water-wash to no-clean solder pastes. Peripheral processes such as cleaning and rework will also be covered.
Briggs is an SMTA-certified process engineer. He earned his associate's degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry. In addition, he earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1990 and has held a variety of positions in production and technical support.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.