Indium Corporation's Jensen, Durham Named Co-Editors of Advancing Microelectronics
April 16, 2015
Indium Corporation's Tim Jensen, senior product manager for engineered solders, and Maria Durham, technical support engineer for semiconductor and advanced assembly materials, have been named co-editors of Advancing Microelectronics.
As editor-in-chief, Jensen is responsible for recruiting new authors and providing editorial direction for the publication. As technical editor, Durham's role is to provide technical guidance to ensure that editorial content meets the goals of the publication.
Jensen is an SMTA-certified process engineer. He has more than 15 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely
with Indium Corporation's technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As the product manager for engineered solders, Jensen is responsible for Indium Corporation's most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials. He earned his bachelor's degree in chemical engineering from Clarkson University and his master's in business administration from Syracuse University.
Durham serves as a technical liaison between Indium Corporation's customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. A critical component of her duties includes performing experiments and collecting data to help customers resolve manufacturing problems. Durham's key areas of expertise include wafer bumping fluxes, package-on-package assembly, and mathematical and engineering modeling. She is an active member of the International Microelectronics Advanced Packaging Society (IMAPS) and has presented and served as session chair at several IMAPS events throughout North America. She is also a two-time winner of Indium Corporation's prestigious Silver Quill Paper of the Year Award. Durham earned her bachelor's degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y.
Advancing Microelectronics magazine is published by IMAPS. It is the premier publication for technical and business-related information for the microelectronics and electronic packaging industries.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
