Dr. Lasky’s workshop, Issues to Be Resolved for SMT Assembly, examined common electronics assembly challenges triggered by the use of lead-free solders, such as head-in-pillow defects, tin whiskers, and voiding. He also detailed possible approaches to help attendees develop strategies to achieve high yields and reliability.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned process expert and Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry, worldwide.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.