InFORMS are patented fabrications in which braided, woven, or random-fiber metal substrate materials are embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate.
InFORMS create solder joints with a precisely controlled final solder joint thickness. The embedded metal does not melt during the reflow process and maintains a precise bondline thickness in the final solder joint. InFORMS maintain the highest thermal and electrical conductivity as compared to typical soldered interconnections, and, by controlling the bondline thickness, the thermal performance is also more repeatable from device-to-device.
InFORMS provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. For more information about InFORMS, visit www.indium.com/thermal-interface-materials or visit Indium Corporation at stand 7-441.
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