Indium Corporation will feature its new SACm™ solder alloy at the inaugural ESTC exhibition May 21-22 in Las Vegas, Nev.

SACm™ is a high-reliability, low-cost solder alloy that offers drop test performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.

SACm™ meets the electronics assembly market’s demand for a solder alloy that offers the combination of good drop test performance, good thermal cycling, lead-free composition, and reduced cost.

The invention of SACm™ offers superior drop test performance versus SAC305 and SAC105, with the added benefit of thermal cycling reliability equivalent to SAC305. This provides manufacturers with an affordable high-reliability SAC alloy. This development is especially meaningful for the manufacture of consumer electronics that normally see frequent handling, such as mobile devices.

SACm™ is doped with manganese and contains less silver than other Pb-free alloys. Manganese provides increased strength, and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.

Indium Corporation will be exhibiting at booth 508.

For more information about Indium Corporation’s SACm™ solder paste, visit www.indium.com/SACm or email SACm@indium.com.