Sehar will present The Use of Solder Preforms in PiP, NanoFoil®, and QFN Void Reduction Applications. This presentation discusses how prefabricated solder forms (preforms) are made and used in demanding electronics assembly applications.
Solder preforms enable precise positioning, as well as volume consistency. They are used in the Pin-in-Paste (PiP) process to eliminate a wave soldering process step, thus providing full barrel fill; in a solder joint fortification process, providing increased solder volume; and in the QFN assembly process to reduce voiding. The presentation will also discuss the use of NanoFoil® preforms for heat-sensitive applications.
Sehar provides field technical support to Indium Corporation’s customers. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in customers’ factories. Sehar is an electrical engineer with more than 20 years of experience, mainly in the areas of process, failure analysis, and production. He earned his bachelor’s degree in electrical and computer engineering from the University of Texas. Sehar is an SMTA-certified process engineer and has earned his Six Sigma Green Belt.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.