Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers Avoid the Void® at Productronica, November 14-17, in Munich, Germany.

The Indium8.9HF Series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding–plus improved stability–during the printing process. Under optimal process conditions, this series:

  • Demonstrates consistent printing performance for up to 12 months when refrigerated
  • Maintains excellent printing and reflow performance after remaining at room temperature for one month
  • Delivers excellent response-to-pause even after being left on the stencil for 60 hours

The Indium8.9HF Solder Paste Series boasts a unique oxidation barrier technology that makes these pastes perfectly suited for a variety of applications, especially automotive assembly.

For more information about Indium Corporation’s low-voiding solder pastes, visit www.indium.com/avoidthevoid or see Indium Corporation in hall A4 at booth 214.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.