Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers Avoid the Void® at Productronica, November 14-17, in Munich, Germany.

The Indium8.9HF Series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding–plus improved stability–during the printing process. Under optimal process conditions, this series:

  • Demonstrates consistent printing performance for up to 12 months when refrigerated
  • Maintains excellent printing and reflow performance after remaining at room temperature for one month
  • Delivers excellent response-to-pause even after being left on the stencil for 60 hours

The Indium8.9HF Solder Paste Series boasts a unique oxidation barrier technology that makes these pastes perfectly suited for a variety of applications, especially automotive assembly.

For more information about Indium Corporation’s low-voiding solder pastes, visit or see Indium Corporation in hall A4 at booth 214.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.