Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium’s unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
“Indium8.9HF1-P has proven low cost-of-ownership for PCB assemblies,” said Tim Jensen, Global Product Manager for Indium Corporation’s PCB assembly products. “Our customers have been asking for a high-performance solder paste that combines excellent printability with probe-testability. This solder paste delivers on all counts. What this means is that Indium8.9HF1-P will deliver long-term reliability for our customers’ end products.”
Indium8.9HF1-P provides high transfer efficiency, and consistent print performance, even at high speeds. Additionally this paste has a robust response-to-pause, lessening the need for frequent under-stencil wiping. Indium8.9HF1-P prints well on apertures with area ratios <0.5, using low print pressures. Indium Corporation’s unique oxidation barrier technology enhances reflow performance, eliminating defects such as head-in-pillow and graping.
Indium8.9HF1-P is optimized for probe-testability in two ways: it has a soft residue after reflow, which is easily penetrable by test probes, and this residue remains probe-testable after multiple reflows, time between reflow and test, and baking.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.