Indium Corporation's Brian Huang, Area Technical Manager for South China, will be presenting at IPC Works Asia 2010, October 26 - 27, 2010, in Shenzhen, China.

Brian's paper, Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly, discusses optimization techniques employed to establish precision SMT printing processes. These techniques are in response to the need to assemble the smaller and smaller components used in miniaturized electronics for mobile phones and other portable devices.

Brian has over five years of experience in SMT process and electronics equipment. He has a master's degree in Material Physics and Chemistry from Xiamen University. Brian has also earned his certification as a Six-Sigma Green Belt.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about IPC or to register for this conference, visit http://www.ipc.org.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.