Indium Corporation’s Tim Jensen, Product Manager – PCB assembly materials, will present his technical findings at two regional SMTA shows in Texas; Dallas on March 12 and Houston on March 14.

Jensen will present Solutions for Head-in-Pillow and QFN Voiding Challenges to show attendees. This presentation discusses the major challenge of eliminating defects caused by miniaturization of components. It also reviews the mechanisms behind the HIP and QFN voiding defects and optimization techniques for material and processes to help reduce them.

Jensen is an SMTA-certified process engineer and earned his bachelor’s degree in chemical engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participating actively in several IPC standards development committees.

The SMTA Dallas and Houston Chapters are part of a network of chapters across the United States, South America, the Middle East, and Asia. Local expos and tech forums provide technical information and an opportunity for engineers to meet with leading suppliers. Exhibitors have an opportunity to connect with people in their region who want to know more about their products and services. For information on upcoming expos, visit their website at www.smta.org/expos.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium, and tin compounds, and high purity metals; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.