Indium Corporation introduces the Indium8.9 Solder Paste Series, which includes Indium8.9HFA and Indium8.9HF-1. These Pb-free and halogen-free solder pastes eliminate graping, head-in-pillow, and QFN defects.

Indium8.9HFA delivers unsurpassed print transfer efficiency to eliminate the insufficient. It also has excellent response-to-pause printing, as well as low voiding (<5%) over many different profiles when soldering BGAs with via-in-pad technology.

Both solder pastes offers a very robust processing window that can minimize potential defects as well as accommodate various board sizes and throughput requirements.

Indium8.9HF-1 Solder Paste is extremely thermally stable and is designed to maintain a soft, pliable residue after reflow. This means easier probe-testability and fewer false rejects and clogged probes during in-circuit testing.

Overall, the Indium8.9 Solder Paste series provides superior performance characteristics that increase customers' cost savings and finished goods reliability.

Indium will be exhibiting at Booth 1A48.

For more information about Indium8.9 Solder Paste, visit www.indium.com/big or email abrown@indium.com.