Indium Corporation’s Brook Sandy-Smith, Product Specialist – PCB Assembly Materials, will present at the inaugural Electronic System Technologies Conference May 20-23 in Las Vegas, Nev.

Sandy-Smith will present Proven Strategies to Minimize Voiding under QFNs and other Bottom Termination Components. Her presentation will review proven approaches for eliminating QFN voiding, including solder paste optimization, process approaches, and the addition of engineered solder preforms.

Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned degrees in chemical engineering, with a focus on materials, and German language from the international engineering program at the University of Rhode Island.

ESTC is a new technical conference and exhibition for the electronics industry. It covers the industry from foundry and components to board assemblies and complete systems. The conference delivers data-driven, high-quality papers by industry experts. The exhibition will showcase the latest products and services in the industry.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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