Indium Corporation announces their latest Silver Quill Award winners.

The winners are: Maria Durham, product support specialist – semiconductor and advanced assembly materials; Christopher Nash, technical support engineer – global accounts; and Mario Scalzo, senior technical support engineer.

Durham and Nash were recognized with an award for Paper of the Year for their two-part paper, titled Solder Paste Dipping & Reflow using 0.4mm-Pitch PoP Packages. The paper was published in a two-part series in Chip Scale Review’s September/October and November/December 2012 issues.

Scalzo was recognized with an award for Outstanding Industry Collaboration for his work on a research paper he wrote jointly with several industry partners. The paper, The Last Will and Testament of the Lead-Free BGA Void, was presented at the International Conference on Solder and Reliability in May 2012.

These papers are available for download from Indium Corporation’s technical library.

Indium Corporation’s Silver Quill Award encourages individuals to author technical reports, presentations, articles, and books, and honors the most effective works. The award emphasizes relevance and impact on the industry.

Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations to ensure the best quality and selection of products. She earned her bachelor’s degree in Physics and Applied Mathematics from Clarkson University where she worked as a McNair Scholar and performed research in electro-chemical deposition.

Nash provides comprehensive technical advice in the selection, use, and application of solder paste, flux, and solder alloy fabrications to customers in the electronics assembly, optoelectronic, semiconductor, and related industries. He earned his bachelor’s degree from Clarkson University and is certified as a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. Nash is also an SMTA Process Engineer and an IPC-A-600 and IPC-A-610D Specialist.

Scalzo, a five-time Silver Quill award winner, holds a bachelor’s degree in chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-certified Process Engineer and is certified as a Six Sigma Black Belt from the Thayer School of Engineering at Dartmouth College. Scalzo is the author of the Electronics Assembly Materials blog, www.indium.com/blogs/Mario-Scalzo-Blog/.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.