All technical papers presented are available for download from Indium Corporation's technical library (http://www.indium.com/technical-documents/whitepaper/):
Ning-Cheng Lee, PhD, Vice President of Technology
- BiAgX Solder Paste System – A Drop-In Solution For High Temperature, Lead-Free Die-Attach Solder: Dr. Lee's paper discussed a mixed powder solder paste technology that was developed as a drop-in solution for high-temperature die-attach applications.
- Voiding Behavior in Mixed Solder Alloy System: Dr. Lee presented data collected while observing the voiding behavior of mixed solder alloy systems under a variety of conditions.
- The Effect of Thermal Pad Patterning on QFN Voiding: In this presentation, Dr. Lee discussed how to avoid QFN voiding by adjusting venting accessibility and using the proper volume of solder.
Ronald Lasky, PhD, PE, Senior Technologist
- A Focus on Productivity: Several Case Studies: Dr. Lasky discussed optimizing profitability via several methods of enhanced productivity.
- Alternative Energy, RoHS: Six Years Later: Dr. Lasky participated in a panel discussion on this topic
- Eliminating Head-in-Pillow Defects: Dr. Lasky presented a poster on this topic.
Timothy Jensen, Product Manager, PCB Assembly Materials
- Material and Process Optimization for Head-in-Pillow Minimization: Jensen's presentation discussed materials- and process-related issues surrounding head-in-pillow defects. He made recommendations on how to eliminate the defect.
- Ruggedized Electronics Coatings and Underfills: Jensen served as the session co-chair.
Brook Sandy-Smith, Product Specialist, PCB Assembly Materials
- Assembly Process Challenges with PoP: Sandy-Smith's presentation discussed package-on-package assembly challenges and gave advice on how to overcome these challenges.
Eric Bastow, Senior Technical Support Engineer
- Proven Technologies for Next Generation Lead-Free Rework: Bastow served as the session chair.
Dr. Lee is a world-renown soldering expert and a SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and an Instructional Professor of Engineering at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books, numerous technical papers, and holds several patent disclosures. Dr. Lasky authors a technology blog, which can be found at http://www.indium.com/drlasky.
Jensen is an SMTA-certified process engineer and earned his bachelor's degree in chemical engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. Jensen authors a blog, which can be found at http://blogs.indium.com/blog/tim-jensen.
Sandy-Smith acts as a technical liaison between Indium Corporation customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned degrees in chemical engineering (with a focus on materials) and German language from the international engineering program at the University of Rhode Island. Sandy-Smith authors a blog, which can be found at http://blogs.indium.com/blog/brooksandy.
Bastow provides technical support for Indium Corporation's full range of solder products for electronics assembly, semiconductor package, and thermal management markets. He is a certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. Bastow is a certified IPC-A-600 and 610D specialist.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium and tin compounds, and high purity metals; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation visit www.indium.com or email email@example.com.