Bloching will present Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window. This presentation discusses the development of an optimized flux technology platform to achieve print for small apertures; how to eliminate the head-in-pillow defect with an enhanced oxidation barrier approach; achieving complete solder coalescence and preventing clumpy solder joints; and reducing voiding in electronics assembly.
Bloching is responsible for growing sales of Indium Corporation’s soldering products, including solder paste, solder wire, engineered solder materials, and thermal management materials in Germany, Austria, and Switzerland. He has more than 15 years of experience in electronics manufacturing. Bloching is a German state-certified engineer in the field of electronics and process engineering.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.