Indium Corporation technology experts will present at the IPC Southeast Asia High Reliability Conference May 28 in Singapore.
Sze Pei Lim, technical manager for Southeast Asia, will present Voiding and Reliability of BGA Assemblies with SAC and 57Bi/42Sn/1Ag Alloys. This presentation explores replacing SAC solders with BiSnAg as a low-cost solution and discusses joint mechanical strength, drop test performance, and voiding performance.
Sehar Samiappan, area technical manager in Malaysia, will present Second Generation Shock Resistant and Thermally Reliable Low Ag SAC Solder with Mn, which discusses the considerable improvement in shock resistance and thermal fatigue performance of a new soldering alloy doped with Mn.
Sze Pei is responsible for managing Indium Corporation’s technical teams throughout the Asia-Pacific region. She joined Indium Corporation in 2007 as an area technical manager. She earned her bachelor’s degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.
Sehar provides field technical support to Indium Corporation’s customers in Malaysia. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in the factories. Sehar is an electrical engineer with over 18 years of experience, mainly in the area of process, failure analysis, and production. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.