Heat-Spring® Bundle Packs
Click Here to Buy This Product Online at Buy.Solder.Com
Heat-Spring® is a soft metal alloy thermal interface material that offers exceptional thermal conductivity (86W/mK). It is a compressible metal that
minimizes surface resistance and increases heat flow, delivering superior performance over time. Heat-Spring bundle kits come in 1.3cm, 2.5cm, 3.8cm, and 5cm squares and range in quantity based on dimensions. Bundles are available in 4 to 6 mil thicknesses for indium-tin and pure indium. Standard kits are available to ship within 24 hours. Custom bundles and sizes require longer lead times. Contact us if you have special shapes or other requirements.


