Semiconductor Packaging & Assembly Materials
- Solder Spheres
- Fluxes & Epoxies
- Bumping Solder Pastes
- Solder Preforms
- Die-Attach Materials
- Dispense-Grade Solder Pastes
Andy Mackie Publishes Article in Advanced Packaging
Andy Mackie, PhD and Semiconductor Product Manager authored an article in Advanced Packaging called Packaging Materials: Trends for 2009. This article discussed industry drivers in standard semiconductor assembly products and power semiconductor die-attach.
