Package-on-Package (PoP) Materials
Introduction
Package-on-Package (PoP) and System-in-Package(SiP) are an exciting new technology that allows standard SMT assembly techniques to be used to manufacture combinations of different integrated circuits. For example, different types of memory may be used in combination to provide both DRAM and Flash in the same package for use in a cell phone.
- PoP Fluxes are suitable for stacking CBGAs and small PBGAs, which are not subject to fl exing.
- PoP Pastes are useful when board fl exing may occur during refl ow, such as larger PBGAs. The presence of a small amount of metal powder allows complete refl owed joints to form, even when the substrate twists and gaps form between the solder sphere and the substrate.
Key Performance Needs:
- Particle-, Crystal-, Bubble-Free
- Homogeneous
- Viscosity stable with time
- Pb-Free alloy compatible
- Applied by dipping
- Air reflow
- Wetting onto a variety of metals
- No-clean materials
Application of Pop Flux
DIP → PLACE → REFLOW →
| Download Product Data Sheets | |
|---|---|
| Paste | |
| 98478.pdf | PoP Paste Indium5.79 |
| 98488.pdf | PoP Paste Indium9.88 |
| 98501.pdf | PoP Paste Indium9.88-HF |
| Flux | |
| 98247.pdf | Package on Package (PoP) Flux 23LV |
| 98412.pdf | Package on Package (PoP) Flux 30B |
| 98511.pdf | Package-on-Package (PoP) Flux 89-LV |
| 98508.pdf | Package-on-Package (PoP) Flux 89HF-LV |
