Paste Selector Kit
This kit allows you to test alloys based on metallurgical compatibility and physical performance for step soldering and other applications. These alloys range in temperature from 96°C to 310°C and include Pb-Free options.
Several of the alloys are indium-based. Compared to tin-lead solders, indium-lead and indium-lead-silver alloys show reduction in scavenging and leaching of gold and silver, and improved resistance to thermal fatigue.
All pastes are Type 3 powder (25-45 microns). Paste can be packaged either in syringes with thumb plungers (50gms per alloy), or jars (100gms per alloy), depending on your application.
Paste Flux Vehicles for the research kit are all rated RO per J-STD-004A.
The shelf life of the solder paste is 6 months at storage temperatures of -20° to 5°C. Room temperature storage below 25°C is acceptable for short time periods.
| Indalloy Number | Alloy | Melting Temperature (°C) |
|---|---|---|
| 1E | 52In 48Sn | 118 E |
| 2 | 80In 15Pb 5Ag | 154 - 149 |
| 4 | 100In | 157 MP |
| 7 | 50In 50Pb | 210 - 184 |
| 42 | 46Bi 34Sn 20Pb | 96 E |
| 97 | 43Sn 43Pb 14Bi | 163 - 144 |
| 104 Sn62 | 62Sn 36Pb 2Ag | 179 E |
| 106 Sn63 | 63Sn 37Pb | 183 E |
| 121 | 96.5Sn 3.5Ag | 221 E |
| 133 | 95Sn 5Sb | 240 - 235 |
| 151 | 92.5Pb 5Sn 2.5Ag | 296 - 287 |
| 204 | 70In 30Pb | 175 - 165 |
| 205 | 60In 40Pb | 181 - 173 |
| 206 | 60Pb 40In | 231 - 197 |
| 241 | 95.5Sn 3.8Ag 0.7Cu | 220 - 217 |
| 256 | 96.5Sn 3.0Ag .05Cu | 220 - 217 |
| 281 | 58Bi 42Sn | 138 E |
| 282 | 57Bi 42Sn 1Ag | 140 - 139 |
| 290 | 97In 3Ag | 143 E |
