Choose A Problem:

BGA/CSP Cracking

Microvia-in-Pad Voiding

Incomplete Barrel Fill

Increased Power Demands

Brittle Pb-Free Alloys

High Wetting Angles

Hot and Cold Slumping

Inconsistent Print Deposition

Inadequate/Excessive Thickness
of Intermetallics Layer

Incompatibility

Hot and Cold Slumping

Insufficient Solder Joints