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Reliability Information Sheet
Reliability

Excellent Ultra-Fine Pitch Printability

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CSP
Problem

Hot and Cold Slumping:

Insufficient Solder Joints

Misprints
   
Problem

Pb-Free Solder Paste: Indium5.1 Series, NC-SMQ230, and Indium5.8LS

Excellent Micro BGA/CSP Printability

Consistent Ultra-Fine Pitch Print Deposition

Long Stable Tack Life

Pb-Free Solder Paste: Indium5.1 Series, NC-SMQ230, and Indium5.8LS

INDIUM5.1 Pb-Free Solder Paste
NC-SMQ230 Pb-Free Solder Paste
INDIUM5.8 LS Pb-Free Solder Paste

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