BGA/CSP Cracking:
Lower Reliability Pb-Free Alloys
Low Solder Joint Strength
Time Consuming Capillary Underfill Process
NF260 No-Flow Underfill:
Excellent Wetting
Low-voiding
Full Underside Encapsulation
Solder Paste and Underfill Reflowed in Single Step
NF260 No-Flow Underfill
NF260 No-Flow Underfill for Pb-Free
