Semiconductor and Advanced Assembly

Semiconductor and advanced assembly materials (SAAM) are designed to enable a semiconductor chip to communicate with the outside world. Indium Corporation products are used in the manufacture of mobile devices, such as cell phones and tablet computers, through computer games, automotive electronics, avionics, server farms, and power handling for renewable energy sources.

Standard and Emerging Semiconductor Assembly

2.5D and 3D chip-stacking

• Wafer bumping fluxes
• Wafer bumping solder pastes
• Copper pillar flip-chip fluxes
• Standard flip-chip fluxes

Flip-chip

• Standard flip-chip fluxes
• Wafer bumping and substrate-bumping solder pastes

Wafer level CSP ball mount

• WL-CSP ball-attach fluxes
• Specialty solder spheres

Ball-attach

• Ball-attach fluxes
• Specialty solder spheres

Package-on-package and fine-pitch component attach

• PoP pastes
• PoP fluxes

Specialty component attach

• Epoxy fluxes

Power Semiconductor

Die-attach

• Die-attach solder pastes
• Die-attach (SSDA) wire

There are other specialty assembly materials that are used in a variety of different applications, such as solder spheres, as well as gold-tin and indium-containing solder pastes, wire, and preforms.

Semiconductor Grade