Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Die-Attach Technical Documents
Product Data Sheets
Safety Data Sheets
Die-Attach Blog Posts
Solderability and Wetting The wetting and spreading of solder onto surfaces is an essential part of forming a strong, reliable, conductive joint. The term "solderability" is a way of talking about how quickly and evenly the solder spreads onto a surface, with strong, low-voiding…
Interesting question from a Chinese die-attach customer this week asking about volume resistivity of solder. My friend, Eric Bastow, suggested that Indium make this available to all through a blog post. It is well understood by Power Semiconductor engineers that a key figure of merit for a low…
I’m still searching for the best use of NanoFoil®. Our customers have used it for LED and CPV die-attachment, sputtering target bonding, battery assembly applications, measurement devices, fuses, as well as many applications which must remain secret. Some of these uses are amazing, to say…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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