Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Die-Attach Technical Documents
Product Data Sheets
Safety Data Sheets
Die-Attach Blog Posts
Those of you who have been watching this blog for a while - waiting for updates on the European ELV (End of Life Vehicle) legislation - wait no more. The Öko-Institut, the Fraunhofer Institute and Eunomia Consulting, which the European Government had commissioned to jointly gather…
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am exhibiting for the first time as the product manager for PCB solder paste for Indium Corporation. I am also co-chair the PCB Component/Connector Rework…
The 47th International Symposium on Microelectronics will be held in San Diego, CA, on October13th through the 16th, 2014. Here's the IMAPS 2014 program. The Indium Corporation will be exhibiting there ... and ... : I will be attending both as an exhibitor and as a session co-chair (Bonding Materials…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
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