Die-Attach
Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Die-Attach Blog Posts
The Magic of Engineered Solders
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…
Heat Dissipation During a NanoBond® Reaction
One of the best parts of using NanoFoil® to create a bond with dissimilar metals or heat sensitive components is that the heat it creates is quickly dissipated before it can heat up areas outside of the bondline. In the pictures above (taken before, during, and after a NanoBond®), you…
No-Clean Solder Paste for Clip-bonding Die-Attach
I’m just back from Malaysia, where I visited one of our larger customers who has been using our high-lead (high-Pb) dispensable NC-SMQ75 solder paste for many years. No surprises there, but what many people don’t realize is that the NC-SMQ75 solder paste can be used as a…
This page is owned by:
Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
amackie@indium.com
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