Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Die-Attach Technical Documents
Product Data Sheets
Safety Data Sheets
Die-Attach Blog Posts
There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Material dependability: Physical: Indium-containing solder paste is very well proven in low temperature usage, however it is also used in some specific…
Those of you who have been watching this blog for a while - waiting for updates on the European ELV (End of Life Vehicle) legislation - wait no more. The Öko-Institut, the Fraunhofer Institute and Eunomia Consulting, which the European Government had commissioned to jointly gather…
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am exhibiting for the first time as the product manager for PCB solder paste for Indium Corporation. I am also co-chair the PCB Component/Connector Rework…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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