Technical Support

Comprehensive Talent

"INDIUM CORPORATION OFFERS THE LARGEST SMTA-CERTIFIED PROCESS ENGINEER TEAM, WORLDWIDE, IN THE INDUSTRY."

Applications Engineers assist in the selection of an Indium Corporation product best suited for a specific application. Thoroughly knowledgeable in all facets of Materials Science as it applies to the electronics, semiconductor, and optoelectronic sectors, Application Engineers provide advice in:

Alloy selection from our list of over 220 solders for specific customer applications.
Physical, mechanical and fatigue life properties of solders.
Substrate metallization, flux, and alloy compatibility.
Solder preform, wire, and ribbon selection.
Soldering and bonding to a variety of substrates.
Applications and knowledge for the unique metal indium and indium chemicals.
Low-melting alloys and fusible alloys applications and assistance.

Technical Support Engineers bring years of SMT expertise, and the knowledge of hundreds of key industry contacts, to your manufacturing floor. Their mission is to optimize the performance of your manufacturing process through proper and creative application of Indium Corporation’s material technologies.

When new interconnect materials are required, Technical Support Engineers will act as the liaison between you, Indium Corporation’s Research and Development laboratory, and outside experts.

Research and Development Scientists advance material science for the creation of new and unique products for electronics, semiconductor, and optoelectronics assembly.

The team is headed by Dr. Ning-Cheng Lee, an SMTA Member of Distinction, author, and well-known expert in materials science and SMT assembly.

Dr. Lee is the author of numerous award-winning papers, and two technical textbooks on SMT assembly and lead-free soldering. He has presented many courses at technical conferences throughout North America, Europe, and Asia.

View our Technical Support Directory.

Full Range of Support

Indium’s Process Simulation Lab

Provides Applications Engineers with the tools to work with you and industry partners on designed experiments to fully characterize SMT assembly materials and their use in leading-edge technology applications, including:

Solder paste response-to-pause testing and transfer efficiency calculations
Voiding analysis and characterization on BGA and CSP components using solder paste, epoxy flux, and no-flow underfill materials in micro via-in-pad applications
Feasibility studies for new technologies and materials
Reflow Profile Optimization

Indium's Process Simulation Lab offers the following capabilities:

Stencil Printing
Precision Syringe Dispensing
Fully Automated 3D
Solder Paste Inspection
Component Placement
Forced Air Convection and Infrared Reflow
Wave Soldering
X-Ray Analysis
Acoustic Microscope Inspection
Temperature-Humidity-Bias Testing (SIR & ECM)
Mechanical Strength Testing
TG/DTA & DSC Analysis
Wetting Balance Testing
Thermal Cycling
And More...