Technical Milestones
- 1934
Indium Corporation® founder, Dr. William Murray, develops an indium electroplating bath to deposit indium onto piston aircraft bearings. This results in a doubling of flight time between engine servicings.
- 1942
Indium Corporation® awarded U.S. Army/Navy "E" Award for technical contributions to aircraft engines.
- 1950-1958
Original thirteen Indalloy® specialty solder alloys developed. Today we offer over 220 alloys with physical properties different from tin-lead eutectic solder.
- 1958
Indium Corporation’s indium and indium gallium solder preforms enable production of Texas Instrument’s first germanium junction transistor.
- 1980
Indium develops the corporation’s first solder paste for electronics assembly.
- 1990
We experiment with microgravity refining processes aboard NASA’s Space Shuttle.
NC-SMQ ®51SC no-clean solder paste introduced. This is the first no-clean paste for SMT assembly with an extended stencil life and wide processing window.
- 1993
Integrated ®Preforms, individual solder preforms joined in an array with fine strands of solder, developed. 1995 Indium Corporation achieves initial ISO 9001 certification.
- 1997
SMT Product Specialist team established. Engineers trained in all facets of SMT assembly quickly optimize processes and solve production problems at customers’ sites.
- 1998
NC-SMQ ®92J halide-free solder paste introduced. 92J was the first paste specifically designed for use with probe testing.
Indium Corporation earns Frost & Sullivan Customer Service Leadership Award.
- 2000
Indium Corporation earns second Frost & Sullivan Customer Service Leadership Award.
- 2001
NC-SMQ ®230 lead-free solder paste introduced. 230 was the first SMT solder paste specifically designed for lead-free assembly.
Indium establishes a powerful, continuously improving, searchable on-line technical knowledge base.
- 2003
Indium Corporation achieves international quality standard ISO 9001:2000 status.
Indium Corporation earns Frost & Sullivan Product Innovation Award for Pb-Free Solder paste development.
Indium Corporation achieves ISO TS16949 certification.
- 2005-2006
NF260, the world's first Air-Reflowable and Reworkable Pb-Free No-Flow Underfill, wins awards on three continents: Global Technology Award (Europe), Vision Award (USA), and Innovation Award (Asia).
- 2006
Indium Corporation earns the Frost & Sullivan Market Engineering Customer Service Leadership Award for developments in the solder paste and adhesive markets.
Indium5.1AT No-Clean Pb-Free Solder Paste wins the Global Technology Award.
