Low Temperature Metallization Pastes for Thin Film and c-Si Solar Cells
Also referred to as "grid ink", "silver ink", and "conductive ink", Indium Corporation offers screen printable low-temperature metallization pastes for thin film PV technologies such as CIGS, a-Si and certain c-Si applications.
Low temperature metallization paste is a silver or silver/copper filled front side current collector material used on thin film solar cells. It gets is low-temperature label because it is processed at lower-than-traditional glass frit temperatures of ~1,000°C.
Indium Corporations Low temperature Metallization pastes offer industry leading print performance, contact resistance, and volume resistivity. LT-918 silver filled metallization pastes has been tested against leading commercial metallization pastes and has been proven to optimize print performance and resist cold slump after printing which minimizes shadowing and increases cell effeciency.
- Industry leading Print Performance
- Low Volume Resistivity
- Low Contact Resistance on ITO and AZO
- High Conductivity
- Flexibility - flexible after drying; used to interconnect both rigid and flexible cells.
- Strong adhesion to a variety of TCO's
- Passes IEC testing requirements
- Superior 85°C/85% RH Stability
- Silver and Silver Plated Copper available
- Drying temperatures as low as 120°
- Stable at room temperature
Designed by Award-Winning Chemists
Indium Corporation's low temperature metallization paste, LTTF-7888 and LT-918 are designed by the same award-winning chemists who also developed the industry-leading printing solder pastes and conductive epoxies for the SMT and semiconductor industries.
Top Metallization Paste Technical Documents
Maximizing the Shelf Life of LT-918 Low Temperature Metallization Paste (Letter)
Metallization Paste Technical Documents
Product Data Sheets
Material Safety Data Sheets
Metallization Paste Blog Posts
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