- Industry-leading print performance
- Low volume resistivity
- Low contact resistance on ITO and AZO
- High conductivity
- Flexibility - flexible after drying; used to interconnect both rigid and flexible cells
- Strong adhesion to a variety of TCOs
- Passes IEC testing requirements
- Superior 85°C/85% RH stability
- Silver and silver-plated copper available
- Drying temperatures as low as 120°C
- Stable at room temperature
Low Temperature Metallization Pastes for Thin Film and c-Si Solar Cells
Also referred to as “grid inkˮ, “silver inkˮ, and “conductive inkˮ, Indium Corporation offers screen printable low-temperature metallization pastes for thin-film PV technologies such as CIGS, a-Si and certain c-Si applications.
Low temperature metallization paste is a silver- or silver/copper-filled front side current collector material used on thin-film solar cells. It gets its low-temperature label because it is processed at lower-than-traditional glass frit temperatures of ~1,000°C.
Indium Corporation’s low-temperature metallization pastes offer industry leading print performance, contact resistance, and volume resistivity. LT-918 silver-filled metallization paste has been tested against leading commercial metallization pastes and has been proven to optimize print performance and resist cold slump after printing, which minimizes shadowing and increases cell efficiency.
Designed by Award-Winning Chemists
Indium Corporation’s low-temperature metallization paste, LT-918, is designed by the same award-winning chemists who also developed the industry-leading printing solder pastes and conductive epoxies for the SMT and semiconductor industries.
For more information, please contact us at firstname.lastname@example.org.
Top Metallization Paste Technical Documents
Metallization Paste Technical Documents
Product Data Sheets
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Metallization Paste Blog Posts
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Director and General Manager of Compounds
From One Engineer to Another®
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