Indium Corporation offers flux cored solder wire used in hand soldering and automated processes during photovoltaic module assembly operations. CW-807 is a standard no-clean flux with clear residues and is available with Sn/Pb, Sn/Pb/Ag and SAC305. Manufactured at Indium's Chicago facility, which employs the most modern equipment and experienced work force, our flux-cored wire is void-free, made with tight dimensional tolerances, operator friendly and widely adopted by PV module manufacturers worldwide.
Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. We offer over 100 alloys in various diameters.
Indium Corporation solder preforms are used extensively in CPV applications to mount III-V silicon dies, bypass diodes and to provide a metallic thermal interface when mounting CPV receiver substrates to a heatsink. Our solder preforms are in the field today in thousands of CPV modules around the world and standup to IEC standards including CPV thermal cycling demands.
Preforms come in custom and standard shapes such as squares, rectangles, washers and discs. Dimensions can be held to tight tolerances to assure volume accuracy.
A wide assortment of alloys is available in liquidus temperatures that range from 47°C to 1063°C. Alloys can be indium-contained, gold-contained, lead-free, fusible or standard tin-lead, as well as many others.
Learn more about Indium Corporation solder preforms here.
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Solder Blog Posts
The Indium Corporation recently had a customer contact us looking for 50In50Pb solder wire. We manufacture large amounts of this indium-lead material as it is used in numerous applications. In this case, it was the application that was quite interesting. I won’t give any customer…
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT optimization using ultrafine solder paste pulls together everything we have discussed previously as…
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If the PCB and component metrics are such that obtaining enough solder (by delivering an adequate volume of solder paste) is an issue, it can be helpful …
Director, Solar Products
From One Engineer to Another®
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