Indium Corporation offers flux cored solder wire used in hand soldering and automated processes during photovoltaic module assembly operations. CW-807 is a standard no-clean flux with clear residues and is available with Sn/Pb, Sn/Pb/Ag and SAC305. Manufactured at Indium's Chicago facility, which employs the most modern equipment and experienced work force, our flux-cored wire is void-free, made with tight dimensional tolerances, operator friendly and widely adopted by PV module manufacturers worldwide.
Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. We offer over 100 alloys in various diameters.
Indium Corporation solder preforms are used extensively in CPV applications to mount III-V silicon dies, bypass diodes and to provide a metallic thermal interface when mounting CPV receiver substrates to a heatsink. Our solder preforms are in the field today in thousands of CPV modules around the world and standup to IEC standards including CPV thermal cycling demands.
Preforms come in custom and standard shapes such as squares, rectangles, washers and discs. Dimensions can be held to tight tolerances to assure volume accuracy.
A wide assortment of alloys is available in liquidus temperatures that range from 47°C to 1063°C. Alloys can be indium-contained, gold-contained, lead-free, fusible or standard tin-lead, as well as many others.
Learn more about Indium Corporation solder preforms here.
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Solder Blog Posts
这几年来，因为某些芯片公司的芯片又要薄，又要低功率，它们自己芯片的warpage又控制不好，在工艺制造流程中出现了新的业界defect, non-wet open, 简称NWO. (不好意思，中文我还真不知道叫啥呢。) 这个现象，就是在贴片某些BGA后，回流过程中由于BGA“笑了”,…
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble vs. no-clean, also plays a significant role. Solder pastes are sensitive to the environment to which…
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “belt” is his solder paste inspection (SPI) equipment. This is especially important for smaller stencil apertures/paste deposits that are difficult…
Director, Solar Products
From One Engineer to Another®
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