Indium Corporation offers flux cored solder wire used in hand soldering and automated processes during photovoltaic module assembly operations. CW-807 is a standard no-clean flux with clear residues and is available with Sn/Pb, Sn/Pb/Ag and SAC305. Manufactured at Indium's Chicago facility, which employs the most modern equipment and experienced work force, our flux-cored wire is void-free, made with tight dimensional tolerances, operator friendly and widely adopted by PV module manufacturers worldwide.
Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. We offer over 100 alloys in various diameters.
Indium Corporation solder preforms are used extensively in CPV applications to mount III-V silicon dies, bypass diodes and to provide a metallic thermal interface when mounting CPV receiver substrates to a heatsink. Our solder preforms are in the field today in thousands of CPV modules around the world and standup to IEC standards including CPV thermal cycling demands.
Preforms come in custom and standard shapes such as squares, rectangles, washers and discs. Dimensions can be held to tight tolerances to assure volume accuracy.
A wide assortment of alloys is available in liquidus temperatures that range from 47°C to 1063°C. Alloys can be indium-contained, gold-contained, lead-free, fusible or standard tin-lead, as well as many others.
Learn more about Indium Corporation solder preforms here.
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At Indium Corporation, we're redefining how we use solder at the die-attach, DBC to baseplate, and baseplate to heat-sink levels so we can achieve a more reliable IGBT that can perform at increasingly higher standards. If you missed the first three videos in this series, get caught up at indium.com/IGBT.
As we've discussed, there are three attach levels of peak concern in the IGBT stack up. At Indium Corporation, we're redefining how we use solder at the die-attach, substrate, and baseplate to heat-sink levels, so we can achieve a more reliable IGBT that can perform increasingly higher standards. If you missed the first two videos in this series, be sure to check them out at www.indium.com/IGBT.
As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use solder at the die-attach, DBC Substrate, and Baseplate level, we can achieve a more reliable IGBT that can form at increasingly higher standards. If you missed that video, be sure to check it out at www.indium.com/IGBT.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
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