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Indium8.9 Series

Home » Products » Solder Paste and Powders » Indium8.9 Series

  • Indium8.9 Series
  • Related
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Indium8.9 Solder Paste

Having Problems With Graping, QFN Voiding or Head-in-Pillow?

Multi-faceted performance to bring the right balance of attributes, tailored to your process

Performance Benefits

HIP Resistance - Graping Resistance - Pin Testing - High Speed Printing - BGA Voiding - QFN Voiding - Pint Transfer Efficiency

Solves: QFN Voiding | Head-in-Pillow | Graping

Ideal for miniaturized components and fine-pitch assembly

  • Designed especially for CSP, 0201, and 01005 components

Robust reflow performance

  • Wide process window for flexible reflow profiling
  • Optimal wetting to all common surface finishes

First-class printing performance

  • Excellent print transfer through tiny apertures with area ratios <0.66
  • Long stencil life and forgiving response-to-pause
  • High component retention tack prevents components from shifting

Resists voiding

  • Low voiding (<5%) for BGAs with via-in-pad technology
Indium8.9

8.9 Solder Paste Eliminates HiP

Key Features:

  • Strong oxidation barrier to promote coalescence after heat exposure
  • High tackiness to maintain contact with components
  • Clear probe-testable flux residue
Download Product Data Sheet
Indium8.9E

8.9E Solder Paste Eliminates Graping

Key Features:

  • Strong oxidation barrier promotes complete coalescence
  • Resists premature flux spread to prevent surfaces from oxidizing
Download Product Data Sheet
Indium8.9HF-1

8.9HF-1 Solder Paste Enables In-circuit Probe Testing

Key Features:

  • Halogen-free
  • Thermally stable residue designed to stay probe-testable
  • Fewer false testing failures means quicker cycle times and less rework
Download Product Data Sheet
Indium8.9HFA

8.9HFA Solder Paste Delivers Superior Printing for Miniaturization

Key Features:

  • Best-in-class high speed printing
  • Optimal print performance for the smallest components and apertures
  • Halogen-free
Download Product Data Sheet
Indium9.0A

9.0A Solder Paste Minimizes QFN Voiding

Key Features:

  • Lowest level of voiding in this series for QFNs, BGAs, and CSPs
  • Oxidation inhibition promotes complete coalescence after long reflow profiles
  • Optimized flux volatiles promote oxidation removal, while reducing gas entrapment
Download Product Data Sheet

Related Markets and Applications

  • Surface Mount
  • Engineered Solder and Alloys

Top Indium8.9 Series Technical Documents

  • Indium8.9HF Pb-Free Solder Paste (Letter) (A4)

    Product Data Sheet

  • Indalloy® with Indium8.9HF

    MSDS

Indium8.9 Series Technical Documents

Whitepapers

Request This Document

Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (English)

Authors: Mario Scalzo

Posted on 11 May 2009

Request This Document

Process Optimization to Prevent the Graping Effect

Authors: Dr. Ronald C. Lasky, Ed Briggs

Posted on 21 Jan 2011

Request This Document

Thermal Pad Design and Process for Voiding Control at QFN Assembly

Authors: Derrick Herron, Dr. Ning-Cheng Lee, Dr. Yan Liu

Posted on 11 Apr 2011

View All

Application Notes

Indium8.9 Pb-Free Solder Paste (Letter)

Product Data Sheets

Indium8.9 Pb-Free Solder Paste (Letter) (A4)
Indium8.9-LDA Pb-Free Solder Paste for IGBT Module Manufacturing (Letter) (A4)
Indium8.9E Pb-Free Solder Paste (Letter) (A4)
Indium8.9E Pb-Free Solder Paste (ULA-Grade) (Letter) (A4)
Indium8.9HF Pb-Free Solder Paste (Letter) (A4)
Indium8.9HF SnPb Solder Paste (Letter) (A4)
Indium8.9HF-1 Pb-Free Solder Paste (Letter) (A4)
Indium8.9HF1-S3 Solder Paste (Letter) (A4)
Indium8.9HFA Pb-Free Solder Paste (Letter) (A4)

View All

Material Safety Data Sheets

Indalloy® with Indium8.9
Indalloy® with Indium8.9E
Indalloy® with Indium8.9HF
Indalloy® with Indium8.9HFA
Indalloy® with Indium8.9LDA
Indalloy® with Indium8.9
Indalloy® with Indium8.9E (ULA)
Indalloy® with Indium8.9HF1
Indalloy® with Indium8.9HFA Flux Vehicle

View All

Solder Paste Blog Posts

NanoFoil® for CPV Attachment

Thursday, April 18, 2013 by Jim Hisert [view bio]

The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less stresses are imparted due to coefficient of thermal expansion. Unlike conductive adhesives or epoxies, NanoBonds® are full metal interfaces which…

Leadframe Solderability Issues in Power Semiconductors

Friday, April 05, 2013 by Dr. Andy Mackie [view bio]

It is no secret that automotive semiconductor customers are becoming increasingly demanding. The "under the hood / bonnet" electronics environment is arguably one of the most thermally stressful environments on the planet. Electronics close to the engine block can experience extremes ranging…

The Magic of Engineered Solders

Friday, April 05, 2013 by Seth Homer [view bio]

Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…

View All Blog Posts

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Tim Jensen

This page is owned by:

Tim Jensen
Product Manger, PCB Assembly Materials
tjensen@indium.com

INDIUM CORPORATIONwww.indium.comaskus@indium.comPRC +86 (0)512 628 34900SINGAPORE +65 6 268 8678UK +44 (0) 1908 580400USA +1 315 853 4900

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