Indium10.8HF Solder Paste
- Excellent non-wet open resistance
- Low voiding on BGA/CSP/QFN
- Superior printing performance
- Good all-around balanced performance
Indium10.8HF Pb-Free Solder Paste Addresses Non-Wet Opens (NWOs)
Indium10.8HF solder paste enables low
cost-of-ownership to PCB assembly customers through an all-around balanced performance, including stencil printing yields, voiding, and soldering yields.
Indium10.8HF is versatile, with a balanced set of properties:
- Meets leading OEM standards for
non-wet open resistance
- Oxidation barrier technology delivers strong resistance to:
- Head-in-pillow defects
- Graping (non-coalescence of powder particles)
- Strong surface oxide cleaning and pad wetting during reflow ramp
- Low voiding on BGSs, CSPs, and QFNs
- Outstanding printing performance with high transfer efficiency and low variability
- Excellent response-to-pause
Indium10.8HF solder paste is best suited for applications with non-wet open induced defects. These are typically BGA microprocessors with thin core substrates and high IO counts that are found in PCs and tablets.
Indium10.8HF Technical Documents
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Product Data Sheets
Safety Data Sheets
Solder Paste Blog Posts
What is the ideal time-above liquidus during solder reflow? Too long or too short can cause dewetting and charring, or not allow the intermetallic formation to wet.
The second stage of a reflow profile activates the flux in the solder paste and prepares the solder for reflow. This can be a critical stage to avoid defects such as tombstoning, voiding, graping, and non-wetting.
It is important to understand the different stages of a reflow profile and how they can affect the end solder joint.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.