Low Temperature/High Temperature
Indium Corporation manufactures a wide variety of alloys that range from high temperature Au-based solders to low temperature indium- and bismuth-based solders.
High temperature solders include gold (Au), gold-tin (AuSn), gold-silicon (AuSi), and gold-germanium (AuGe). Alloys that melt at over 270°C are considered brazing alloys.
Gold-based alloys are used in high reliability applications, such as hermetic sealing, aerospace, and medical. These alloys have a high tensile strength, superior thermal fatigue resistance, exceptional thermal conductivity, as well as resistance to corrosion and oxidation.
Low temperature solders include indium- and bismuth-containing alloys such as bismuth-tin (BiSn). They are available as solder preforms, solder paste, solder wire, ingot, or solder ribbon. Applications for low temperature alloys include:
- soldering temperature sensitive components
- step soldering
- soldering LEDs
Indium-containing alloys can be used for cryogenic applications, TCE mismatch, and applications that need improved thermal fatigue performance.
Indium Corporation also manufactures solders that are liquid at room temperature. Also referred to as liquid metal, these gallium-containing solders can melt at temperatures as low as 7°C. Liquid metals are available in a syringe or bottle.
To select the right alloy for your application, contact one of our technical support engineers.
Related Markets and Applications
Top Low Temperature/High Temperature Technical Documents
Product Data Sheet
Indium5.7LT Solder Paste (Letter)
Product Data Sheet
Physical Constants of Pure Indium (Letter)
Procedures for Handling Indalloys (Liquid at Room Temperature) (Letter)
Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework (Paper)
Low Temperature/High Temperature Technical Documents
Product Data Sheets
Safety Data Sheets
Solder Paste Blog Posts
Here at Indium Corporation we produce many forms of solder. With products like solder ingots, solder paste, and solder wire - we supply the alloys our customers need in the forms they want. One form of solder that is very interesting to me is the solder preform. In this series we will explore the solder…
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, especially in areas where the area ratio is below 0.66. Because ~60% of solder defects typically occur at the printer, it is vital to success to focus on…
Folks, Looks like Patty has been busy..... Patty couldn’t remember having a busier week. She just got back on Friday from serving on a review board for statistics projects that West Point cadets had worked on. Then, she and Rob had to put their Christmas tree up. …
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.