Low Temperature/High Temperature
Indium Corporation manufactures a wide variety of alloys that range from high temperature Au-based solders to low temperature indium- and bismuth-based solders.
High temperature solders include gold (Au), gold-tin (AuSn), gold-silicon (AuSi), and gold-germanium (AuGe). Alloys that melt at over 270°C are considered brazing alloys.
Gold-based alloys are used in high reliability applications, such as hermetic sealing, aerospace, and medical. These alloys have a high tensile strength, superior thermal fatigue resistance, exceptional thermal conductivity, as well as resistance to corrosion and oxidation.
Low temperature solders include indium- and bismuth-containing alloys such as bismuth-tin (BiSn). They are available as solder preforms, solder paste, solder wire, ingot, or solder ribbon. Applications for low temperature alloys include:
- soldering temperature sensitive components
- step soldering
- soldering LEDs
Indium-containing alloys can be used for cryogenic applications, TCE mismatch, and applications that need improved thermal fatigue performance.
Indium Corporation also manufactures solders that are liquid at room temperature. Also referred to as liquid metal, these gallium-containing solders can melt at temperatures as low as 7°C. Liquid metals are available in a syringe or bottle.
To select the right alloy for your application, contact one of our technical support engineers.
Related Markets and Applications
Top Low Temperature/High Temperature Technical Documents
Product Data Sheet
Indium5.7LT Solder Paste (Letter)
Product Data Sheet
Physical Constants of Pure Indium (Letter)
Procedures for Handling Indalloys (Liquid at Room Temperature) (Letter)
Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework (Paper)
Low Temperature/High Temperature Technical Documents
Product Data Sheets
Safety Data Sheets
Solder Paste Blog Posts
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT optimization using ultrafine solder paste pulls together everything we have discussed previously as…
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If the PCB and component metrics are such that obtaining enough solder (by delivering an adequate volume of solder paste) is an issue, it can be helpful …
The plane landed, I got my bags, and I drove home. What a great show. The SMTA International show took place September 28 to October 2 this year in Rosemont, Illinois, and I was there. Last week I got the opportunity, with some of my colleagues, to attend SMTAI, experience several technical sessions,…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.