Low Temperature/High Temperature
Indium Corporation manufactures a wide variety of alloys that range from high temperature Au-based solders to low temperature indium- and bismuth-based solders.
High temperature solders include gold (Au), gold-tin (AuSn), gold-silicon (AuSi), and gold-germanium (AuGe). Alloys that melt at over 270°C are considered brazing alloys.
Gold-based alloys are used in high reliability applications, such as hermetic sealing, aerospace, and medical. These alloys have a high tensile strength, superior thermal fatigue resistance, exceptional thermal conductivity, as well as resistance to corrosion and oxidation.
Low temperature solders include indium- and bismuth-containing alloys such as bismuth-tin (BiSn). They are available as solder preforms, solder paste, solder wire, ingot, or solder ribbon. Applications for low temperature alloys include:
- soldering temperature sensitive components
- step soldering
- soldering LEDs
Indium-containing alloys can be used for cryogenic applications, TCE mismatch, and applications that need improved thermal fatigue performance.
Indium Corporation also manufactures solders that are liquid at room temperature. Also referred to as liquid metal, these gallium-containing solders can melt at temperatures as low as 7°C. Liquid metals are available in a syringe or bottle.
To select the right alloy for your application, contact one of our technical support engineers.
Related Markets and Applications
Top Low Temperature/High Temperature Technical Documents
Product Data Sheet
Indium5.7LT Solder Paste (Letter)
Product Data Sheet
Physical Constants of Pure Indium (Letter)
Procedures for Handling Indalloys (Liquid at Room Temperature) (Letter)
Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework (Paper)
Low Temperature/High Temperature Technical Documents
Product Data Sheets
Safety Data Sheets
Solder Paste Blog Posts
Indium Corporation works hard to ensure that we have solder pastes that suit all of our customers’ needs. Our R&D team works closely with our customers to anticipate future needs and develop products to meet them. Our newest solder paste, Indium10.1, is one of those products. Indium10.1 is…
In our continued investigation and quest to improve solder paste printing for fine-feature paste deposits, we also found that consistency (low standard deviation) favored the square apertures when comparing circular apertures to square apertures with radius corners (hereafter referred to only as square…
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble vs. no-clean, also plays a significant role. Solder pastes are sensitive to the environment to which…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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