Low Temperature/High Temperature
Indium Corporation manufactures a wide variety of alloys that range from high temperature Au-based solders to low temperature indium- and bismuth-based solders.
High temperature solders include gold (Au), gold-tin (AuSn), gold-silicon (AuSi), and gold-germanium (AuGe). Alloys that melt at over 270°C are considered brazing alloys.
Gold-based alloys are used in high reliability applications, such as hermetic sealing, aerospace, and medical. These alloys have a high tensile strength, superior thermal fatigue resistance, exceptional thermal conductivity, as well as resistance to corrosion and oxidation.
Low temperature solders include indium- and bismuth-containing alloys such as bismuth-tin (BiSn). They are available as solder preforms, solder paste, solder wire, ingot, or solder ribbon. Applications for low temperature alloys include:
- soldering temperature sensitive components
- step soldering
- soldering LEDs
Indium-containing alloys can be used for cryogenic applications, TCE mismatch, and applications that need improved thermal fatigue performance.
Indium Corporation also manufactures solders that are liquid at room temperature. Also referred to as liquid metal, these gallium-containing solders can melt at temperatures as low as 7°C. Liquid metals are available in a syringe or bottle.
To select the right alloy for your application, contact one of our technical support engineers.
Related Markets and Applications
Top Low Temperature/High Temperature Technical Documents
Product Data Sheet
Indium5.7LT Solder Paste (Letter)
Product Data Sheet
Physical Constants of Pure Indium (Letter)
Procedures for Handling Indalloys (Liquid at Room Temperature) (Letter)
Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework (Paper)
Low Temperature/High Temperature Technical Documents
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Product Data Sheets
Safety Data Sheets
Solder Paste Blog Posts
Phil Zarrow: Ron, we’ve discussed that performance of materials can affect productivity, and hence profitability. Can you give us an example?
Ron Lasky: Yeah. I was working with a certain customer that had a problem with their solder paste that we call poor response-to-pause. As you’re aware, probably several times a day, the assembly line has to be shut down to replenish components. And in that pause time, some solder pastes can stiffen up. And then we turn the line back on and you make a stencil print, that first print is bad. And you have to wipe that board and reprint it again. You lose probably about two minutes, maybe every two hours.
Phil Zarrow: And how can this affect the bottom line?
Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Stromberg with a proposal to develop a certification workshop for SMT Process Engineers. The inaugural span...
The Indium Corporation has many summer interns this year. The technical support group was fortunate enough to hire Sarah Bjornland (pictured). She is a very bright student from the a...
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.