Low Temperature/High Temperature

Indium Corporation manufactures a wide variety of alloys that range from high temperature Au-based solders to low temperature indium- and bismuth-based solders.

High temperature solders include gold (Au), gold-tin (AuSn), gold-silicon (AuSi), and gold-germanium (AuGe). Alloys that melt at over 270°C are considered brazing alloys.

Gold-based alloys are used in high reliability applications, such as hermetic sealing, aerospace, and medical. These alloys have a high tensile strength, superior thermal fatigue resistance, exceptional thermal conductivity, as well as resistance to corrosion and oxidation.

Low temperature solders include indium- and bismuth-containing alloys such as bismuth-tin (BiSn). They are available as solder preforms, solder paste, solder wire, ingot, or solder ribbon. Applications for low temperature alloys include:

• soldering temperature sensitive components
• step soldering
• soldering LEDs

Indium-containing alloys can be used for cryogenic applications, TCE mismatch, and applications that need improved thermal fatigue performance.

Bismuth-containing solders can be used for fusible links, such as fuses, sprinkler heads, or blow-out valves.

Indium Corporation also manufactures solders that are liquid at room temperature. Also referred to as liquid metal, these gallium-containing solders can melt at temperatures as low as 7°C. Liquid metals are available in a syringe or bottle.

To select the right alloy for your application, contact one of our technical support engineers.