Low-Temperature Solders for Every Application
Low-temperature solders are the ideal solution to combat the challenges faced by the miniaturization of components in electronic devices, and the conversion to RoHS-compliant lead-free assembly.
Indium Corporation has a variety of low-temperature, RoHS-compliant solder solution to suit your production needs.
Cryogenics (< -150°C): Pure indium metal (Indalloy #4) is used in cryogenic applications because it remains malleable, even in the extreme temperatures seen in liquefied gases, such as nitrogen (LN2) or helium (LHe). Indium metal also has excellent thermal conductivity. Additionally, its softness and malleability will allow it to compensate for CTE mismatches between many different types of joined surfaces, even rough surfaces.
Safety: Low-melting solders also work well as temperature indicators, and are commonly used in food preparation thermometers or in fire detection devices. Some specialty electrical fuses also use low-melting alloys.
Soldering: Low-temperature soldering is used in electronics interconnect, where the use of higher reflow temperatures can lead to failures. Some applications are:
- Temperature-sensitive components, such as some crystal oscillators, MEMS devices, and some III/V semiconductors
- Low-melting or low-Tg flex circuitry, which are used in cellphones, smartwatches, and a huge variety of internet-of-things (IoT) devices
- Large area array devices, such as BGAs, to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures
- Step-soldering, when a secondary, lower temperature reflow process is required after a standard eutectic or SAC soldering process
- Bi58/Sn42 (Indalloy #281) and the more reliable Bi57/Sn42/Ag1 (Indalloy #282) are common in these applications.
- Bismuth- and indium-based solders are also available.
Low-Temperature Technical Documents
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Product Data Sheets
Safety Data Sheets
Low-Temperature Blog Posts
Indium is an ingredient in many low-melting point solder alloys, helping reduce the energy required to assembly numerous products.
The demand for hermetic packages that house laser diodes is growing, and companies that traditionally made RF/microwave packages are now expanding their businesses into optical packages.
We encounter many hurdles when developing an efficient, reliable soldering process. But, sometimes, getting over the first hurdle can make the next one more difficult.
Indium metal conforms to irregular surfaces, greatly increasing the contact area.
Although Indium Corporation was founded in New York State (and maintains our corporate office here) in the USA, we have strong ties to a great many areas around the world. One being Germany.
Most people think of our alloys only in the ‘soldering’ sense. However, these same materials may be used in applications where they aren’t designed to melt and attach components.
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due to their lower melting temperatures—58Bi/42Sn is eutectic at 138°C and 57Bi/42Sn/1Ag melts 137-139°C (both are Pb-free alternatives).
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.