Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
Package-on-Package Paste Technical Documents
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Safety Data Sheets
Package-on-Package Blog Posts
80Au20Sn solder paste and preforms both have particular attributes that make them ideal for certain bonding applications. We take a look at how your production furnace determines which form you use, and how material characteristics help aid in production.
High aspect ratio solder preforms allow engineers to bring the connector leads closer together
Gold-based solder alloys have superior strength and conductivity; perfect for applications requiring a high temperature, reliable bond that can hold up to extreme environments.
From One Engineer to Another®
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