Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
Package-on-Package Paste Technical Documents
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Package-on-Package Blog Posts
Eric Bastow discusses gold as a solder and braze ingredient. he covers physical properties and applications of gold and gold alloys, including 80Au20Sn, 88Au12Ge, and AuSi. The discussion includes melting points, soldering procedures, corrosion resistance, and more.
You may have heard the 80% gold 20% tin alloy referred to as a solder. Or, you may have heard it called a braze. I’m going to explain how both statements ...
Estimating the Per Cent Gold In An Alloy: "Wet Gold Technique" Only Works with One Alloying Element… and You Must Know What That Element Is
Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can determine the percentage of gold using a formula similar to that in the Indium...
Product Manager, PCB Solder Paste
From One Engineer to Another®
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