Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
Package-on-Package Paste Technical Documents
No presentations to display
Safety Data Sheets
Package-on-Package Blog Posts
Summary: Gold solder alloys are valuable due to their unique range of reflow temperatures and their resistance to corrosion, making them ideal for high reliability optical and laser hermetic package housing assemblies.
Eric Bastow discusses gold as a solder and braze ingredient. he covers physical properties and applications of gold and gold alloys, including 80Au20Sn, 88Au12Ge, and AuSi. The discussion includes melting points, soldering procedures, corrosion resistance, and more.
You may have heard the 80% gold 20% tin alloy referred to as a solder. Or, you may have heard it called a braze. I’m going to explain how both statements ...
Product Manager PCB Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.