Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
Related Markets and Applications
Package-on-Package Paste Technical Documents
No whitepapers to display
No presentations to display
No application notes to display
Safety Data Sheets
No safety data sheets to display
Package-on-Package Blog Posts
Estimating the Per Cent Gold In An Alloy: "Wet Gold Technique" Only Works with One Alloying Element… and You Must Know What That Element Is
Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can determine the percentage of gold using a formula similar to that in the Indium...
Folks, Let’s check in on Rob, while Patty is away…… Rob waved good bye to Patty as she drove away to the airport to attend a one week conference. Now that she was a prof and he a grad student at Ivy U, they seldom traveled and he knew he was going...
Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin finish melts at too high a temperature (Tm= 232°C) for the SAC305 solder paste (Tm = 219°C) to melt...
Product Manager, PCB Solder Paste
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.