Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
Package-on-Package Paste Technical Documents
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Package-on-Package Blog Posts
For some reason, I find the combination of gold and indium incredibly interesting. This shouldn’t come as a surprise; I caught gold fever panning for gold during a trip to Alaska, and “indium fever” is a pre-requisite for my job. Well, if it isn’t – it should be.
80Au20Sn solder preforms transfer heat from the active layer in laser diodes, creating a strong bond for long-term reliability.
Typically, applications that use gold-tin solders are structural or die-attach. Structural applications make use of the alloy’s high strength, wide operating ...
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