Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Wafer Bumping Paste Technical Documents
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Safety Data Sheets
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Solder Paste Blog Posts
Non-Wet Opens (NWO): Understand the cause as well as the necessary flux technology to mitigate them.
In SMT Statistical Process Control, the bottom line is that Cpk is king. Here's the proof.
Three IPC test methods are used to guarantee to customers that they are getting the same material (within agreed tolerances). However one test has not changed in decades and almost always gives the wrong answer!
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
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