Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
As with many companies exhibiting at SMTAI, Indium Corporation is featuring several new products that address many of the concerns of our customers. I recently posted about Indium10.1, a Pb-free solder paste that prevents voiding under large components, and we recently introduced RMA-155, a…
I am happy to announce that Indium Corporation will participate in the Power and High Temperature Electronics Manufacturing Experience at SMTAI. This event is coordinated by my good friend, Bob Willis. This is the first…
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am exhibiting for the first time as the product manager for PCB solder paste for Indium Corporation. I am also co-chair the PCB Component/Connector Rework…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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