Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Wafer Bumping Paste Technical Documents
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Safety Data Sheets
Solder Paste Blog Posts
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow introduce Indium Corporation’s new halogen-free, no-clean, low-voiding solder paste–Indium10.1HF.
Trying to select and develop the proper reflow profile? This video explores the differences between the three main profile types.
From One Engineer to Another®
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