Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Wafer Bumping Paste Technical Documents
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Safety Data Sheets
Solder Paste Blog Posts
What is the ideal time-above liquidus during solder reflow? Too long or too short can cause dewetting and charring, or not allow the intermetallic formation to wet.
The second stage of a reflow profile activates the flux in the solder paste and prepares the solder for reflow. This can be a critical stage to avoid defects such as tombstoning, voiding, graping, and non-wetting.
It is important to understand the different stages of a reflow profile and how they can affect the end solder joint.
From One Engineer to Another®
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