Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
Finally – the fun part! After all of your work specifying the right materials and applying them, at last we can test all of the assumptions we have made, and the effects of our assembly process. There are many criteria you can test, depending on a specific application, but, in general, you will…
My last post talked about the pros and cons of CalRod® style preheaters. This post will be devoted to hot air style preheaters. It makes sense that this was, most likely, the first form of preheating which would have been used to dry rosin-based fluxes that were popular in the past. Hot air removed…
For this week’s World of Solder Preforms series installment, Brandon Judd explains the importance of reflow profiling: Solder preforms are a very common method of reducing voiding in a soldered device with larger X/Y dimensions. Compared to solder paste (which is approximately 50% flux by…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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