Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
Folks, Looks like Patty has been busy..... Patty couldn’t remember having a busier week. She just got back on Friday from serving on a review board for statistics projects that West Point cadets had worked on. Then, she and Rob had to put their Christmas tree up. …
This year I’ve had the chance to work, and become friends, with Bryan Dygert, one of our solder preform manufacturing work cell operators at the Indium Corporation. During one of our discussions, Bryan was interested in the idea of relating his work at Indium with his past career. Here is what…
Those of you who have been watching this blog for a while - waiting for updates on the European ELV (End of Life Vehicle) legislation - wait no more. The Öko-Institut, the Fraunhofer Institute and Eunomia Consulting, which the European Government had commissioned to jointly gather…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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