Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Wafer Bumping Paste Technical Documents
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Safety Data Sheets
Solder Paste Blog Posts
There exists a wide range of assembly products for the SiP process, especially solder pastes.
The printing differences between no-clean and water-soluble solder paste. Keywords: Phil Zarrow, Ed Briggs, firstname.lastname@example.org, printing, water-soluble, sold...
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
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