Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
Let's check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar EMS company, he was used to doing the intimidating. However, he had just finished a meeting with the CEOs of his two biggest customers and it was…
There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Material dependability: Physical: Indium-containing solder paste is very well proven in low temperature usage, however it is also used in some specific…
Here at Indium Corporation we produce many forms of solder. With products like solder ingots, solder paste, and solder wire - we supply the alloys our customers need in the forms they want. One form of solder that is very interesting to me is the solder preform. In this series we will explore the solder…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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