Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
NanoFoil® for CPV Attachment
The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less stresses are imparted due to coefficient of thermal expansion. Unlike conductive adhesives or epoxies, NanoBonds® are full metal interfaces which…
Leadframe Solderability Issues in Power Semiconductors
It is no secret that automotive semiconductor customers are becoming increasingly demanding. The "under the hood / bonnet" electronics environment is arguably one of the most thermally stressful environments on the planet. Electronics close to the engine block can experience extremes ranging…
The Magic of Engineered Solders
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…
This page is owned by:
Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
amackie@indium.com
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