Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement - by hiring professionals from the arts (e.g. singers, actors, artists etc.) In this spirit, I am going not quite so far from electronics assembly, to ask one…
Indium metal powder is mixed with flux for application by dispensing or printing equipment. This mixture is referred to as solder paste. Lucky for you, Indium Corporation is the technology leader in deposition technology for solder pastes. We have local Technical Support Engineers near you to…
People use indium in many forms - to create many different products. Certain forms fit various applications. Here are some of the many forms of pure indium that we provide: Ingot – this is the bulk form of indium, but it can still be customized. Sizes are available from small ‘finger’…
Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
From One Engineer to Another®
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