Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble vs. no-clean, also plays a significant role. Solder pastes are sensitive to the environment to which…
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “belt” is his solder paste inspection (SPI) equipment. This is especially important for smaller stencil apertures/paste deposits that are difficult…
During the summer months I'm a big fan of grilling. Up until very recently I've grilled everything from hot dogs to steaks using nothing but my propane grill and my natural instincts of how hot and how long to cook my dinner. The results have been pretty good with the occasional…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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