Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Wafer Bumping Paste Technical Documents
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Safety Data Sheets
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Solder Paste Blog Posts
Voiding is a complex problem with complex solutions. It isn't always just a matter of switching out the solder paste and finding the solution.
If you're being challenged to voiding issues, contact Indium Corporation. We'll work with you to optimize your process, and to identify the right product for you, and together we'll achieve better results for you.
For process engineers hoping to reduce voiding in electronics assembly, watch as I discuss the reliability of Indium10.1 and Indium8.9HF and how they are made to help you Avoid the Void™.
Solder paste properties have a large effect on voiding. I dig into this area deeply and talk about how we can minimize large ground plane solder voiding in electronics assembly based on differences in solder paste.
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.