Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Wafer Bumping Paste Technical Documents
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Safety Data Sheets
Solder Paste Blog Posts
Phil Zarrow explains how to store the unused portion of an open container of solder paste, and what to do with the leftover solder paste that's already been on the stencil.
Indium Corporation’s Tech Seconds video series answers electronics assembly industry’s most commonly asked question in 60 seconds or less.
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow introduce Indium Corporation’s new halogen-free, no-clean, low-voiding solder paste–Indium10.1HF.
From One Engineer to Another®
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