Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
It sounds bad for me to say this, but I have a lot of SMT magazines cross my desk and, honestly, the solder paste articles rarely draw my interest. I work in a world of solder preforms and that’s really where my mind is at, currently. A recent exception is a paper written by Eric Bastow (Assistant…
Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin finish melts at too high a temperature (Tm= 232°C) for the SAC305 solder paste (Tm = 219°C)…
Let's check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar EMS company, he was used to doing the intimidating. However, he had just finished a meeting with the CEOs of his two biggest customers and it was…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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