Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
Folks, Let's check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world's smallest electronics components, known as 01005s. Patty was sitting in her office contemplating beginner’s luck. She was adding this topic to her…
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT optimization using ultrafine solder paste pulls together everything we have discussed previously as…
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If the PCB and component metrics are such that obtaining enough solder (by delivering an adequate volume of solder paste) is an issue, it can be helpful …
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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