Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
A while ago, my colleague, Jim Hisert, interviewed me and wrote a Technical Support Spotlight piece on me. Now that I’ve been in the Technical Service department for a while, I’ve decided to join my colleagues in blogging. Here is a little bit of background: At Oklahoma State…
Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recognize ROL0 and ROL1 classified fluxes and solder pastes as being "no-clean". And often people will "recognize" an OR classified flux…
The beginning of 2014 brought an interesting opportunity for me, the availability of a position as a Manufacturing Engineer at Indium Corporation (at our BPD facility in Utica NY). So far it has been a great way to gain new skills and work with a different product line than I have in the past. I’m…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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