Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
Phil Zarrow: Ron, we’ve discussed that performance of materials can affect productivity, and hence profitability. Can you give us an example?
Ron Lasky: Yeah. I was working with a certain customer that had a problem with their solder paste that we call poor response-to-pause. As you’re aware, probably several times a day, the assembly line has to be shut down to replenish components. And in that pause time, some solder pastes can stiffen up. And then we turn the line back on and you make a stencil print, that first print is bad. And you have to wipe that board and reprint it again. You lose probably about two minutes, maybe every two hours.
Phil Zarrow: And how can this affect the bottom line?
Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Stromberg with a proposal to develop a certification workshop for SMT Process Engineers. The inaugural span...
The Indium Corporation has many summer interns this year. The technical support group was fortunate enough to hire Sarah Bjornland (pictured). She is a very bright student from the a...
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
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