Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
Here at Indium Corporation we produce many forms of solder. With products like solder ingots, solder paste, and solder wire - we supply the alloys our customers need in the forms they want. One form of solder that is very interesting to me is the solder preform. In this series we will explore the solder…
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, especially in areas where the area ratio is below 0.66. Because ~60% of solder defects typically occur at the printer, it is vital to success to focus on…
Folks, Looks like Patty has been busy..... Patty couldn’t remember having a busier week. She just got back on Friday from serving on a review board for statistics projects that West Point cadets had worked on. Then, she and Rob had to put their Christmas tree up. …
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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