Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
Indium Corporation works hard to ensure that we have solder pastes that suit all of our customers’ needs. Our R&D team works closely with our customers to anticipate future needs and develop products to meet them. Our newest solder paste, Indium10.1, is one of those products. Indium10.1 is…
In our continued investigation and quest to improve solder paste printing for fine-feature paste deposits, we also found that consistency (low standard deviation) favored the square apertures when comparing circular apertures to square apertures with radius corners (hereafter referred to only as square…
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble vs. no-clean, also plays a significant role. Solder pastes are sensitive to the environment to which…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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