Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Wafer Bumping Paste Technical Documents
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Safety Data Sheets
Solder Paste Blog Posts
Re-exploring solder paste's "five ball rule" in SMT stencil printing.
Vacuum Reflow can help reduce voiding in SMT assembly but the process varies from conventional convection reflow. Here's how to achieve the best results possible.
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