Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Solder Paste Blog Posts
The beginning of 2014 brought an interesting opportunity for me, the availability of a position as a Manufacturing Engineer at Indium Corporation (at our BPD facility in Utica NY). So far it has been a great way to gain new skills and work with a different product line than I have in the past. I’m…
Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industry to focus more on the printing process to obtain fewer end-of-line defects and higher quality. This has raised the question, "What are the…
While in South East Asia last summer, Indium's technical team and I had a chance to discuss flip-chip dipping processes with a major equipment vendor. One of the topics was device (bumped package or die) "pick-up" out of a flip-chip flux dipping tray, and how different factors affect…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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