Water-Soluble Solder Pastes
Over the last decade, the electronics industry has shifted to no-clean fluxes for surface mount assembly. Despite this industry trend, Indium Corporation has not only maintained a variety of quality water-wash/water-soluble fluxes and solder pastes, but has revolutionized the category with release of a versatile new solder paste – Indium6.4R. Indium6.4R Solder Paste allows current water wash manufacturing processes to not only survive, but thrive.
Indium6.4R delivers reduced voiding, exceptional printing and >8 hour stencil life in controlled environments. It also maintains it tack over time. Indium6.4R is suitable for SnPb eutectic alloys as well as Pb-free alloys. It excels in a variety of applications and has proven successful in the automotive industry.
Products Compatible with Indium6.4R Solder Paste:
|1081||Low||28.4||0.957||ORH0||ORH0||< 50 ppm||Foam||16-1081||Preferred product.
|Electronics applications; water-soluble|
Other Water-Soluble Solder Pastes:
|Indium3.2||Water Wash||SAC||Maximizes the process window with a long stencil life and strong humidity resistance|
|Indium3.2HF||Water Wash||SAC||Halogen-free version of Indium3.2 solder paste|
|Indium6.3||Water Wash||SnPb||Possesses industry-leading wetting properties|
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Today's Indium Mailbag question asks about the storage of indium-contained solder paste at a temperture well below the recommended temperature of -20.
What is the ideal time-above liquidus during solder reflow? Too long or too short can cause dewetting and charring, or not allow the intermetallic formation to wet.
The second stage of a reflow profile activates the flux in the solder paste and prepares the solder for reflow. This can be a critical stage to avoid defects such as tombstoning, voiding, graping, and non-wetting.
From One Engineer to Another®
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