Water-Soluble Solder Pastes
Over the last decade, the electronics industry has shifted to no-clean fluxes for surface mount assembly. Despite this industry trend, Indium Corporation has not only maintained a variety of quality water-wash/water-soluble fluxes and solder pastes, but has revolutionized the category with release of a versatile new solder paste – Indium6.4R. Indium6.4R Solder Paste allows current water wash manufacturing processes to not only survive, but thrive.
Indium6.4R delivers reduced voiding, exceptional printing and >8 hour stencil life in controlled environments. It also maintains it tack over time. Indium6.4R is suitable for SnPb eutectic alloys as well as Pb-free alloys. It excels in a variety of applications and has proven successful in the automotive industry.
Products Compatible with Indium6.4R Solder Paste:
|1081||Low||28.4||0.957||ORH0||ORH0||< 50 ppm||Foam||16-1081||Preferred product.
|Electronics applications; water-soluble|
Other Water-Soluble Solder Pastes:
|Indium3.2||Water Wash||SAC||Maximizes the process window with a long stencil life and strong humidity resistance|
|Indium3.2HF||Water Wash||SAC||Halogen-free version of Indium3.2 solder paste|
|Indium6.3||Water Wash||SnPb||Possesses industry-leading wetting properties|
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Solder Paste and Powders Technical Documents
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Solder Paste and Powders Blog Posts
The second stage of a reflow profile occurs around the activation temperature of the flux in the solder paste and prepares the solder for reflow. Several considerations must be taken into account.
It is important to understand the different stages of a reflow profile and how they can affect the end solder joint.
From One Engineer to Another®
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