White Papers

Indium Corporation conducts extensive research on the soldering fundamentals for Surface Mount Technology and other electronics applications.

Browse our library for abstracts of some of the most popular published articles that you may find useful in your efforts to improve your process results. All papers in our library are available for download.

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    Papers by Amanda Whittemore

  • Virtues of Indium as a Thermal Interface Material

    by Dr. Ronald C. Lasky, Amanda Whittemore

    The element indium is an ideal thermal interface material (TIM) for heat dissipation in many of today’s very fast, very hot integrated circuits. Its key advantage is its high bulk thermal conductivity, but other attributes include a low tensile strength and indium’s ability to lower melting temperatures when alloyed with other elements.

    [Permanent Link to this Paper]

    Posted on 10 Mar 2010

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