White Papers

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Papers by Aniket A. Bhave

• Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

  by Aniket A. Bhave, Daryl Santos PhD, Dr. Ronald C. Lasky

  Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.

  pb-free, lead-free, stencil printing, solder paste, solder paste evaluation

  [Permanent Link to this Paper]

  Posted on 31 Mar 2010

• Six Sigma® Techniques for Solder Paste Selection

  by Wang Ming, Aniket A. Bhave, Dr. Daryl Santos, Dr. Ronald C. Lasky, Sniket A. Bhave

  Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure. By using designed experiments and the measurement of critical solder paste related process metrics, we were able to develop a solder paste evaluation procedure that maximizes information about the solder paste and its processability while minimizing experimentation. While using only 12 stencil printed PWBs, we were able to generate statistically significant results that enabled us to rank solder pastes according to their performance. Response metrics that were investigated were print volume and definition before and after pause, squeegee hang up, slump, tack, release from aperture, and solder joint quality. In addition, we found such variation in solder paste volume repeatability that this criterion alone can be used as a screening procedure.

  lead-free, pb-free, solder paste evaluation, solder paste, stencil printing

  [Permanent Link to this Paper]

  Posted on 9 Mar 2010

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