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Papers by Brandon Judd

• Next Generation PoP Pastes for Electronics Assembly

  by Jim Hisert, Brandon Judd

  Package-on-package (PoP) technology allows two or more electronic components to be stacked vertically, which saves space and allows our portable gadgets to continue getting smaller year after year. A relatively new form of solder paste called "PoP Paste" has been developed specifically for this application.

  There are fundamental differences between PoP pastes and the traditional solder pastes, which are designed for printing applications. This paper will highlight the differences between these solder pastes and talk about the characteristics needed by PoP pastes to increase transfer efficiency, eliminate head-in-pillow defects, and provide excellent solder wetting. If these three criteria are met, solder joint reliability will follow.

  head-in-pillow, Dipping Flux, Dipping Paste, package on package, PoP Solder Paste, BGA

  [Permanent Link to this Paper]

  Posted on 15 Oct 2009

• Optimizing Your Stencil Printing Process

  by Brandon Judd

  As a technical support engineer for a solder paste supplier, I often travel to customers’ facilities in order to troubleshoot a process issue on an SMT line. Although there are several issues that may arise regarding the placement and reflow portion of production, the product may be doomed from the very beginning if the stencil printing process is not optimized. There are several variables involved in the stencil printer setup.

  [Permanent Link to this Paper]

  Posted on 9 Mar 2010

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