White Papers

Check the box next to each paper you want to download. You may download as many papers as you wish. After selecting papers and completing the contact information form on this page, the paper(s) will be e-mailed to you at the e-mail address you provide.

Papers by Frank Komitsky Jr.

• Die Attach in Lead Frame Packages: A Tutorial

  by Frank Komitsky Jr., Dr. Ronald C. Lasky

  Although much of the “buzz” in the industry surrounds the newer “high tech” packages such as ball grid array (BGA), chip scale packages (CSP) and flip chip, the foundation of modern electronics is the lead frame package. The major lead frame packages small outline integrated circuits (SOICs) and plastic quad flat packs make up the bulk of all surface mount integrated circuit packages manufactured in the world. See Figure 1. With 70 billion produced in 2004, they represent about 70% of all surface mount packages. So many are made, that every man, woman and child on earth could be given 11 of these packages each year. Laid end to end, a year’s worth of production of these packages would reach farther than from the earth to the moon and back.

  semiconductor packaging, semiconductor assembly, lead frame, die attach

  [Permanent Link to this Paper]

  Posted on 19 May 2010

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