White Papers

Check the box next to each paper you want to download. You may download as many papers as you wish. After selecting papers and completing the contact information form on this page, the paper(s) will be e-mailed to you at the e-mail address you provide.

Papers by James Slattery

• A Drop-In Lead-Free Solder Replacement

  by Dr. Ning-Cheng Lee, Iris Artaki, James Slattery, John R. Sovinsky, Paul T. Vianco

  Environmental and toxicity concerns related to the use of lead have initiated the search for acceptable, alternate joining materials for electronics assembly. This paper describes a novel lead-free solder designed as a "drop in" replacement for common tin/lead eutectic solder. The physical and mechanical properties of this solder are discussed in detail with comparison to tin/lead eutectic solder. The performance of this solder when used for electronics assembly is discussed and compared to other common solders. Fatigue testing results are reported for thermal cycling electronics assemblies soldered with this lead-free composition. The paper concludes with a discussion on indium metal availability, supply and price.

  pb-free, surface mount, SMT, solder paste, reflow, electronic, lead-free, soldering, solder

  [Permanent Link to this Paper]

  Posted on 1 Jan 2009

• A Novel Flexible Silver Paste Enables Thin Film Photovoltaic Flex Solar Cells

  by Dr. Ning-Cheng Lee, James Slattery, Lee Kresge, Dr. Hong-Sik Hwang

  A flexible high performance Ag metallization paste LTTF-6363 has been developed for thin film photovoltaic flex solar cells. The binder of the paste is soft epoxy-based resin system. Compared with a thermoplastic paste system, LTTF-6363 exhibits superior adhesion and is flexible. These features enable the deployment of flex solar panels where tolerance against rolling or bending is critical. LTTF-6363 also displays excellent print characteristics and non-slump performance. This is extremely important for maximizing the effective open areas on solar cells. LTTF-6363 exhibits very good solderability, thus allows easy soldering connection with other electronic devices.

  Thin Film, volume resistivity, contact resistance, solar cell, photovoltaic, metallization paste, flex

  [Permanent Link to this Paper]

  Posted on 2 Mar 2010

• A Quick Guide to Solder Preforms

  by Paul Socha, James Slattery

  Solder preforms are manufactured shapes of solder or braze metal designed to fit a specific joint configuration. Preforms contain precise and predetermined quantities of an alloy or a pure metal. They have been used in a variety of applications, such as hybrid and discrete component assembly and surface mount technology. Used in place of traditional solder forms such as wire and ingot, preforms offer advantages for different applications, including versatility enhanced production economies and flexibility.

  preforms, solder

  [Permanent Link to this Paper]

  Posted on 10 Mar 2010

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