Papers by Jordan Ross
by Bob Jarrett , C.K. Merritt, Jordan Ross , Jim Hisert
This paper relates the application of two of the methods for testing the
thermal interface materials to the development and characterization of high performance materials. Particular strengths of different test methods provide a more complete understanding of TIM performance. In combination the tools provide effective development and improvement metrics. The limitations in resolution and repeatability are discussed.
thermal test vehicle, ASTM D5470, TIM testing
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Posted on 4 Mar 2010
by Ross B. Berntson, Bob Jarrett , Jordan Ross
CHINESE LANGUAGE, TIM
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Posted on 11 Mar 2010
by Bob Jarrett , Jordan Ross , Ross B. Berntson
Metal thermal interface materials (TIMs) offer substantially higher thermal conductivity than other commercially available TIMs. With this high conductivity, these metal TIMs offer the lowest thermal interface
resistance, enabling design of higher power and smaller electronic devices. Additionally, the high conductivity translates to less sensitivity to bond line thicknesses and coplanarity issues than polymeric TIMs. This paper discusses the use of metal thermal interface materials
in critical heat flow situations.
TIM
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Posted on 4 Mar 2010
by Bob Jarrett , Jordan Ross
As today’s technology devices continue to get smaller and more powerful, the need for high performance thermal interface materials is becoming more critical. Metal thermal interface materials are the ideal solution to fill this need. The high thermal conductivity of metals and alloys determines how they can be used in thermal solutions. Metals dominate heat sink, spreader, and heat pipe applications due to their high conductivity, as well as their ease and flexibility in fabrication. In critical heat flow situations, metals are frequently used as the thermal interface material (TIM) in the thermal solution.
TIM
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Posted on 8 Mar 2010
by Jordan Ross , Andy C. Mackie PhD , Dave Saums, Bob Jarrett
The rise in the heat flux and total power dissipated from semiconductor devices has been well documented in semiconductor packaging industry forecasts. [1, 2, 3] This increasing heat flux (power per unit area, or power density) is not limited to microprocessors and server processors. This general trend affects a variety of commercial and military power semiconductor devices as well as integrated circuits (IC).
The primary determinant of a thermal solution for a semiconductor device or module is the overall heat dissipation. However, at a macro level, the localized heat flux is typically a more critical concern for device reliability. Hot spots with extremely high heat fluxes are a significant concern in the thermal management of processors, RF, wide band gap, power LED, and other semiconductor devices.
indium metal, phase change materials, TIM, thermal management
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Posted on 1 Jul 2009
