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Papers by Liyakathali Koorithodi

• Solder Paste Technology

  by Liyakathali Koorithodi

  Solder paste is a vital material for the modern electronics industry as it enables surface mount assembly. Without solder paste, modern electronics would not exist. The performance of the solder paste directly affects the stencil printing and reflow soldering processes, and contributes directly to the manufacturing yields and reliability. The development and manufacture of solder paste is multidisciplinary and encompasses metallurgy, physics, chemistry, rheology and other fields.

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  Posted on 9 Mar 2010

• Thermal Profiling: A Practical Approach to Reflow Profiling

  by Liyakathali Koorithodi

  In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies. A thermal profile is an important record, process tool, and history of PCB assembly — an electrocardiogram (ECG) of your solder process. Profiling requires in-depth process knowledge and practice. Moreover, it is an art. Reflow soldering profiling warrants more discussion in detail.

  [Permanent Link to this Paper]

  Posted on 10 Mar 2010

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