White Papers

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Papers by Manchao Xiao

• Probe Testability of No-Clean Solder Pastes

  by Dr. Ning-Cheng Lee, Paul A. Jaeger, Manchao Xiao

  The probe-testability of no-clean solder paste flux residue at in-circuit-test is determined mainly by the residue amount, residue location, and residue hardness. The testability increases with decreasing amount of residue, decreasing amount of top-side flux spread, and increasing amount of bottom-side flux spread. The residue amount, top-side flux spread, and bottom-side flux spread affect primarily pad probing, pad probing, and pin-tip probing, respectively. Inert reflow atmosphere helps probe penetration. Higher metal load effectively reduces the flux spreading. Among all, the soft residue approach appears to be most promising in providing successful probe contact.

  lead-free, pb-free, no-clean, flux residue, solder paste, testability, probe

  [Permanent Link to this Paper]

  Posted on 1 Jan 2009

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