White Papers

Check the box next to each paper you want to download. You may download as many papers as you wish. After selecting papers and completing the form at the bottom of this page, the paper(s) will be e-mailed to you at the e-mail address you provide.

Papers by Paul T. Vianco

• A Drop-In Lead-Free Solder Replacement

  by Dr. Ning-Cheng Lee, Iris Artaki, James Slattery, John R. Sovinsky, Paul T. Vianco

  Environmental and toxicity concerns related to the use of lead have initiated the search for acceptable, alternate joining materials for electronics assembly. This paper describes a novel lead-free solder designed as a "drop in" replacement for common tin/lead eutectic solder. The physical and mechanical properties of this solder are discussed in detail with comparison to tin/lead eutectic solder. The performance of this solder when used for electronics assembly is discussed and compared to other common solders. Fatigue testing results are reported for thermal cycling electronics assemblies soldered with this lead-free composition. The paper concludes with a discussion on indium metal availability, supply and price.

  pb-free, surface mount, SMT, solder paste, reflow, electronic, lead-free, soldering, solder

  [Permanent Link to this Paper]

  Posted on 1 Jan 2009

The paper(s) you request will be e-mailed in .pdf format to the e-mail address you provide. Please allow up to an hour for the server to process your request.

All fields are required.