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Papers by Sigurd R. Wathne PE

• Simple Testing to Evaluate Ball Attach Fluxes

  by Jim Hisert, Sigurd R. Wathne PE

  The best way to test a flux is to conduct the test in the production line under actual working conditions. This can be impractical if too many materials are included in the evaluation process. There are, however, ways to understand the capabilities of a wide range of flux materials without scrapping a large amount of production parts and time. This article will outline a test procedure that can be used to initially compare fluxes with minimal time, capital expense, and equipment. The key data is the quality of a flux to promote wetting of various alloys on a variety of surface finishes. [1] This will be calculated as a change in solder diameter after reflow. Although solder spread is the numerical outcome of the testing, cleanability of water-soluble fluxes and post reflow residue of no-clean fluxes may become apparent to the technician involved in this testing. It is a good way to get a feel for a material set in a very short time.

  Solder Melting, Solder Basics, solder alloy, solder, pb-free, Flux Cleaning, flux, BGA, ball attach

  [Permanent Link to this Paper]

  Posted on 1 Jan 2009

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