White Papers

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Papers by Thomas Acchione

• Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)

  by Thomas Acchione, Jim Hisert

  Solar PV cell and module manufacturers are looking for new and improved assembly materials and process enhancements to increase throughput, reduce cost, and improve cell efficiency. To reach these (dynamic) higher goals for thin film deposition, new materials and cost-effective processes are needed. Depositing the target material directly onto the backing plate is typically used when conventional target bonding is simply not possible because of the low-melting point range of materials. When using the low melting alloys or single elements in thin film cells (CIG, CuGa, In, and InSn), it is possible to use a localized heat source to bond them at room temperature. This paper discusses:

  1) the casting of these low-melting alloy sputtering targets, and
  2) the subsequent bonding of the alloys to a backing plate for use in existing equipment.

  In addition, the presentation will demonstrate the bonding of low-melting point metallic sputtering targets, as well as how to verify the performance of these targets during operation.

  solar, sputtering target, NanoFoil

  [Permanent Link to this Paper]

  Posted on 21 Jan 2011

• Room Temperature LED and D-Pak Type Component-Attach and Reliability Testing

  by Mario Scalzo, Thomas Acchione

  Engineers working with LED and D-pak type component-attach are looking for improved assembly materials and process enhancements to increase throughput, reduce cost, and improve product efficiency and reliability. Many of these packages are susceptible to higher voiding on the ground plate-attach during reflow. A room temperature process would lower voiding, reduce the failure rate, and increase the lifetime of the component. Technology developments have proven that it is possible to use a localized heat source to bond components at room temperature. This paper discusses the bonding of LED and D-pak components at room temperature. It also talks about the quality and long term reliability of the components. The presentation will demonstrate the component bonding process both manually and through the use of automation, and show attendees how to verify the performance of the components post bonding.

  NanoFoil, NanoBond, LED, CTE mismatch, room temperature bonding

  [Permanent Link to this Paper]

  Posted on 24 Jan 2011

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